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Horizontal Furnace Systems |
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The HF-Series wafer
processing systems are designed for our customers who require high
through-put production tools
in fabs where the longer flat zones and larger wafer load sizes ensure
reduced cost per wafer. For all high volume production processes, from sub-micron to large feature devices, wherever horizontal furnace systems make good economic sense in the fab tool set, the Expertech HF-Series systems are a proven workhorse solution to large-batch processing requirements. These furnace and LPCVD systems are manufactured to the highest quality standards, in our state of the art facility, using the most recent innovations in wafer processing equipment. Key to our goal of “building the best” is finding the best fit of design for each customers application and budget. Outstanding performance, reliability, long equipment life span, and low total cost of ownership are built into every tool. |
| Model: | HF150 Series | HF200 Series | HF300 Series |
| Substrate Sizes: | 150mm | 200mm | 300mm |
| Temperature Range: | 200-1300°C | 200-1300°C | 200-1300°C |
| Furnace Flatzone(inches): | 30" and 40" | 24" and 32" | 20" and 30" |
| Number of Tubes/stack: | 4 | 3 | 2 |
| Process Control System Options: |
Thermco TMX 9-12k |
Thermco
TMX 9-12k (Brooks) SEMY Mypro ICCI SLC99 |
Thermco
TMX 9-12k (Brooks) SEMY Mypro ICCI SLC99 |
| Supervisory System Options: |
Brooks |
Brooks (SEMY) JGA ICCI GMI-Host |
Brooks (SEMY) JGA ICCI GMI-Host |
| Typical Atmospheric Processes Supported: | Pyrogenic
Oxidations (Internal/External Torch) DI-H2O derived Oxidation (special hi-saturation, auto-fill, long cycle) Diffusion Dopant Processes (liquid and solid source) Anneal (inert and reducing atmosphere) |
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| Typical LPCVD Processes Supported: | Poly-Silicon
(lo-temp, amorphous, hi-temp H2, and doped) Silicon Nitride (standard ratio and low-stress films) LTO, PSG, BPSG TEOS Vacuum Anneal |
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